Google recently published a guide outlining eight essential design patterns for multi-agent systems, ranging from sequential ...

The British Treasury is set to insure the Bayeux Tapestry against damage for an estimated £800 million while it is on loan to ...

The Electric solar wind Sail doctors (E-Sailors) is a challenge-based Doctoral Network that aims to bring Electric solar wind sail (E-sail) from low Earth orbit (LEO) demonstration missions to the ...

This blog post was authored by Domenic Koyama, Senior Preconstruction Director, McCarthy Building Companies; and Fernando Sanchez, Director of Design Integration, McCarthy Building Companies. Parking ...

The Fusion by Advanced Superconducting Tokamak project, designed to demonstrate fusion energy power generation in Japan in the 2030s, has reached its first key milestone, Starlight Engine and Kyoto ...

In 1896, architect Louis Sullivan — mentor to the great Frank Lloyd Wright — coined the phrase “form follows function.” It has since become a maxim for myriad designers across nearly every industry.

To achieve EV potential by squeezing more functionality into a given volume, and delivering value at a compelling price point, means there are strong incentives for integrating motor and inverter.

The White House has fired six members of the U.S. Commission of Fine Arts, the independent federal agency that advises the president and Congress on design plans for monuments, memorials, coins and ...

The competition entries are expected to deliver: - Identity and Program of the Park-Forest– A functional solution for the planned program elements with strong design qualities intended for the rest ...

Turner Construction, Whiting-Turner Contracting Company, STO Building Group, DPR Construction, HITT Contracting, Hensel Phelps, Holder Construction, AECOM, and Clayco top Building ...

LOS ANGELES, CA – September 25, 2025 – Proteus Space, a leading innovator in rapid satellite design, digital modeling, AI&T, flight and operations solutions, has been selected by NASA for a ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...