The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...

AMD unveiled Ryzen AI 400 and Embedded processors at CES 2026, touting up to 60 TOPS NPUs and new chips for laptops, desktops ...

Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today unveiled its SRG091X and SRG093X series modules at CES in Las Vegas, delivering integrated CPU, memory and wireless ...

Ryzen AI Embedded processors that offer higher-performance, lower-latency artificial intelligence to automotive, industrial ...

The new Ryzen AI 400 series packs Zen 5 cores, RDNA 3.5 graphics, and XDNA 2 NPUs, promising faster AI performance and ...

AMD CEO and Chair Dr Lisa Su unveiled new products across the client, graphics, embedded, and commercial segments during her ...

AMD introduces new AI chips to challenge Nvidia's dominance in the data center market, with plans for even faster systems in the future.

Accenture is bringing over 400 AI specialists into its ranks and adding Faculty's CEO as its new chief technology officer.

ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

News Highlights AMD provided an early look at its “Helios” rack-scale platform, the blueprint for yotta-scale AI infrastructure, built on AMD ...

News Highlights New AMD Ryzen™ AI Embedded P100 and X100 Series processors combine high-performance “Zen 5” CPU cores, an AMD RDNA™ 3.5 GPU and ...

AMD’s 2025 performance points to a shift from chips to platforms. CES 2026 reinforced execution, but this year's deployments ...