This repository contains a Simscape model of a quadrupeded robot able to walk on flat and inclined terrain, with a environment that presents different obstacles, and the posibility of open-loop or ...
Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...
Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...
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