Abstract: The rapid diffusion of Ag–Au usually results in weak interface joints, which significantly impacts the stability of wide bandgap (WBG) devices. Therefore, the interdiffusion mechanism at the ...
Abstract: Solid–liquid interdiffusion (SLID) bonding finds a wide variety of potential applications toward die-attach, hermetic encapsulation of microelectromechanical systems (MEMS) devices and 3-D ...
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