Abstract: Decapsulation of plastic Integrated Circuit (IC) packages is an important step in package level failure analysis. In this paper, optimization of a Microwave Induced Plasma (MIP) system for ...
Abstract: Decapsulation is the process of removing mold compound from the die surface of a plastic encapsulated device. Typically, the mold compound is removed only in the area above the die and bond ...
In a recent video, [Andrew Zonenberg] takes us through the process of decapsulating a PIC12F683 to take a peek at its CMOS implementation. This is a multipart series with five parts done and more to ...
IC-Light is a project to manipulate the illumination of images. The name "IC-Light" stands for "Imposing Consistent Light" (we will briefly describe this at the end of this page). Currently, we ...
This C library implements FrodoKEM, an IND-CCA secure key encapsulation (KEM) protocol based on the well-studied Learning with Errors (LWE) problem [1,3], which in turn has close connections to ...
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