AMD Introduces Ryzen AI Embedded Processor Portfolio, Powering AI-Driven Immersive Experiences in Automotive, Industrial and ...

The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...

ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

Automotive audio has evolved from entertainment-only purposes to being an integral part of the driving experience.

AMD unveiled GPUs, Helios racks, Ryzen AI 400 PCs, ROCm 7.2, and new embedded chips to bring AI across devices and industries ...

At CES 2026, AMD outlined how it sees artificial intelligence becoming a standard part of personal and commercial computing, ...

News Highlights AMD provided an early look at its “Helios” rack-scale platform, the blueprint for yotta-scale AI infrastructure, built on AMD ...

Intel kicks off CES 2026 by launching Core Ultra Series 3 processors, its first AI PC platform built on the 18A process, ...

AMD’s 2025 performance points to a shift from chips to platforms. CES 2026 reinforced execution, but this year's deployments ...

Generative Bionics, an Italian company developing Physical AI powered humanoid robots, unveiled its first concept at CES 2026 ...

AMD introduces new AI chips to challenge Nvidia's dominance in the data center market, with plans for even faster systems in the future.

GIGABYTE Technology, a global leader known for its engineering excellence in high-performance computing and AI servers, ...