Abstract: The need to train the next generation of embedded systems (ESs) engineers with relevant skills across hardware, software, and their co-design remains pressing today. This letter describes ...

Ryzen AI Embedded processors that offer higher-performance, lower-latency artificial intelligence to automotive, industrial ...

Abstract: Due to better performance and lower manufacturing cost, system in package (SiP) has attracted more attention in recent years. Fixed-outline component placement and ball assignment are the ...