CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

At the end of January, Advanced Chip Engineering Technology (ACE) will begin applying its WLCSP (wafer-level chip-scale package) burn-in, packaging and testing solution to 256Mbit DDR (double data ...

Over the past year, companies like Cerebras have made headlines for their use of wafer-scale processing. TSMC wants to grow this area of its business and plans to build out its InFO_SoW (Integrated ...

Cerebras Systems Inc. has revised its plan to go public on the Nasdaq stock exchange. The company, which develops artificial intelligence chips for data centers, filed to list its shares last ...

Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...

Since the introduction of DDR memory, packaging technologies have become the focus for many manufacturers. Wen Kun Yang, chairman and CEO of Advanced Chip Engineering Technology (ACE), believes that ...

The promise of a new type of computer chip that could reshape the future of artificial intelligence and be more environmentally friendly is explored in a technology review paper published by UC ...