IC substrate maker Nan Ya Printed Circuit Board (NPC) has reported revenues for May down 1% on month to NT$2.18 billion (US$67 million), while Kinsus Interconnect Technology and Phoenix... IC ...
The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...
The "Advanced IC Substrates Market Size, Share & Industry Analysis Report By Type, By Technology, By Application, By Regional Outlook and Forecast, 2025-2032" report has been added to ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
AT & S Austria Technologie & Systemtechnik AG engages in the development, manufacture, and trade of printed circuit boards (PCB) and IC substrates. It operates through the following segments: Mobile ...
Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...
LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that requires no metal plating. The breakthrough ...
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from... Unimicron ...
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