DATAQUEST

Kioxia showcases highly stackable oxide-semiconductor channel transistors

Developed core technology that will allow practical implementation of high-density, low-power 3D DRAM, presented at IEEE International Electron Devices Meeting (IEDM) ...
Business Wire

Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the ...
Nature

Dynamic Random Access Memory Technologies

Dynamic random access memory (DRAM) remains a cornerstone of modern electronic systems, enabling rapid data storage and retrieval. Recent developments have focused on capacitorless designs – notably ...
Semiconductor Engineering

Smaller Geometries, Bigger Demands: The Role Of OCD In GAA Logic And Vertical Gate DRAM Process Control

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief ...